High-precision cov pob ceramic yog spherical cov khoom siv ua los ntawm zirconium oxide (sitostatic) los yog al₂o₃) los yog aluminium oxinging ({0 -199 0 degree) thiab ultra-precision sib tsoo cov txheej txheem. Silicon nitride cov khoom pob muaj cov zoo dua ntawm 3.20-3,30 G /MACE HARDENCE 6-16 Qhov chaw saum npoo av ra tsawg dua lossis sib npaug rau 0.01 μm, lub sphererity yuam kev tsawg dua los yog sib npaug ntawm qhov kub thiab txias (}} lossis sib npaug rau 3.2 × 10⁻⁶ / degree). Pob zeb diamond sib tsoo log yog siv nyob rau hauv cov qhabnias rau ntau hom machis-tshuab. Txuas sib tsoo thiab sib nqus cov kua hlau polishing tshuab 36], tawg, pits, pits thiab snowflake tsis meej (qhov xwm txheej<0.01%), combined with ultrasonic C-scan non-destructive testing with a resolution of 10μm to ensure a sub-surface crack detection rate of ≥99.9%; in high-speed bearing applications, the friction coefficient is as low as 0.001–0.005, the maximum speed reaches 3×10⁶dN value (d is the aperture mm, N is rpm), and the service life is increased by 5–8 times compared with steel balls. The global market size is expected to reach US$1.27 billion in 2025, mainly used in semiconductor wafer polishing (particle size 0.1–3mm tolerance ±0.05μm), aircraft engine spindle bearings (DN value ≥2.5×10⁶) and new energy vehicle electric drive systems (anti-electrolytic corrosion grade Class 5).
Ceramic jquamic me ntsis nta
Lub neej ntev
Hnyav dua li kev sib tw tshaj plaws
Kev xaiv ntau qhov ntau thiab tsawg thiab cov duab
Polishing
Lub Sijhawm Txheej Txheem Kev Sib Tw
Tej Heramic Pricws Cov Ntaub Ntawv
Hlau Thiab Titanium
Kev Tiv Thaiv Xub ntawm Cov Khoom Hlau
Ntug rounding
Tshem tawm ntawm machining cim
Tshem tawm ntawm cov nplais hlais thiab roj los ntawm kev txiav laser txiav


Peb cov khoom nthuav qhia



Cim npe nrov: Tej hub pob rau Matishing, Tuam Tshoj Ceramic Pob Rau Cov Khoom Siv Ua Si, Hoobkas








